Semiconductor device and method for driving the same

ABSTRACT

Disclosed is a semiconductor device having a memory cell which comprises a transistor having a control gate and a storage gate. The storage gate comprises an oxide semiconductor and is able to be a conductor and an insulator depending on the potential of the storage gate and the potential of the control gate. Data is written by setting the potential of the control gate to allow the storage gate to be a conductor, supplying a potential of data to be stored to the storage gate, and setting the potential of the control gate to allow the storage gate to be an insulator. Data is read by supplying a potential for reading to a read signal line connected to one of a source and a drain of the transistor and detecting the change in potential of a bit line connected to the other of the source and the drain.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.13/166,029, filed Jun. 22, 2011, now allowed, which claims the benefitof a foreign priority application filed in Japan as Serial No.2010-145339 on Jun. 25, 2010, both of which are incorporated byreference.

TECHNICAL FIELD

The invention disclosed herein relates to a semiconductor device using asemiconductor element, a method for manufacturing the semiconductordevice, and a method for driving the semiconductor device.

In this specification, a semiconductor device refers to any device thatcan function by utilizing semiconductor properties. A semiconductorcircuit, a storage device, an imaging device, a display device, anelectro-optical device, an electronic device, and the like are allsemiconductor devices.

BACKGROUND ART

Storage devices using semiconductor elements are broadly classified intotwo categories: a volatile device that loses stored data when powersupply stops, and a non-volatile device that retains stored data evenwhen power is not supplied.

A typical example of a volatile storage device is a DRAM (dynamic randomaccess memory). A DRAM stores data (information) in such a manner that atransistor included in a storage element is selected and electric chargeis stored in a capacitor.

When data is read from a DRAM, electric charge in a capacitor is lost onthe above principle; thus, another write operation is necessary everytime data is read. Moreover, a transistor included in a storage elementhas a leakage current and electric charge flows into or out of acapacitor even when the transistor is not selected, so that the dataretention time is short. For that reason, another write operation(refresh operation) is necessary at predetermined intervals, and it isdifficult to sufficiently reduce power consumption of the storageelement. Furthermore, since stored data is lost when power supply stops,an additional storage device using a magnetic material or an opticalmaterial is needed in order to hold the data for a long time.

Another example of a volatile storage device is an SRAM (static randomaccess memory). An SRAM retains data by using a circuit such as aflip-flop and thus does not need a refresh operation. This means that anSRAM has an advantage over a DRAM. However, cost per storage capacity isincreased because of the use of a flip-flop or the like. Moreover, as ina DRAM, stored data in an SRAM is lost when power supply stops.

A typical example of a non-volatile storage device is a flash memory. Aflash memory includes a floating gate between a gate electrode and achannel formation region in a transistor and stores data by holdingelectric charge in the floating gate. Therefore, a flash memory hasadvantages in that the data retention time is extremely long (almostpermanent) and a refresh operation which is necessary in a volatilestorage device is not needed (e.g., see Patent Document 1).

However, a gate insulating layer included in a storage elementdeteriorates by tunneling current generated in writing, so that thestorage element stops its function after a limited number of writeoperations. In order to reduce adverse effects of this problem, a methodof equalizing the number of write operations for storage elements isemployed, for example, in which case a complicated peripheral circuit isneeded. Moreover, employing such a method does not solve the fundamentalproblem of lifetime. In other words, a flash memory is not suitable forapplications in which data is frequently rewritten.

In addition, high voltage is necessary to inject electric charge in thefloating gate or to remove the electric charge, and a circuit forgenerating high voltage is also necessary. Further, it takes arelatively long time to perform an operation for injecting or removingelectric charge, so that it is not easy to increase the speed of writeand erase operations.

REFERENCE

-   Patent Document 1: Japanese Published Patent Application No.    S57-105889

DISCLOSURE OF INVENTION

In view of the foregoing problems, an object of one embodiment of theinvention disclosed herein is to provide a semiconductor device with anovel structure in which stored data can be retained even when power isnot supplied, and there is no limitation on the number of write cycles.

Another object is to provide a semiconductor device with highintegration and large storage capacity.

Another object is to provide a highly reliable semiconductor device withhigh stability in operation.

Another object is to provide a semiconductor device capable ofhigh-speed operation.

Another object is to provide a semiconductor device with low powerconsumption.

Each embodiment of the invention disclosed in this specificationachieves at least one of the above objects.

In one embodiment of the invention disclosed herein, a storage gateincluding an oxide semiconductor is provided in a transistor. Thestorage gate is configured to be made to be a conductor, and a specificpotential is supplied to the storage gate. After that, the storage gateis made to be an insulator to hold the potential (electric charge).

One embodiment of the present invention is a semiconductor device thatincludes: a memory cell including a transistor including a control gateand a storage gate; a word line; a data line; a read signal line; and abit line. The control gate is electrically connected to the word line.The storage gate is electrically connected to the data line. One of asource and a drain of the transistor is electrically connected to theread signal line. The other of the source and the drain of thetransistor is electrically connected to the bit line.

One embodiment of the present invention is a semiconductor device thatincludes a memory cell including: a transistor having a first gate and asecond gate which includes an oxide semiconductor; a first wiring; asecond wiring; a third wiring; and a fourth wiring. The first gate iselectrically connected to the first wiring. The second gate iselectrically connected to the second wiring. One of a source and a drainof the transistor is electrically connected to the third wiring. Theother of the source and the drain of the transistor is electricallyconnected to the fourth wiring.

As the oxide semiconductor used for the storage gate or the second gate,an intrinsic (i-type) or substantially intrinsic oxide semiconductor ispreferably used. An intrinsic oxide semiconductor (including an oxidesemiconductor that becomes intrinsic by application of an electricfield) has a sufficiently low carrier density (e.g., lower than1×10¹²/cm³, or lower than 1.45×10¹⁰/cm³), and thus serves as aninsulator.

Data can be stored in the following manner: a potential of data to bestored is applied to the oxide semiconductor used for the storage gateor the second gate when the oxide semiconductor is made to serve as aconductor by application of an electric field, and the potential(electric charge) is held by making the oxide semiconductor intrinsic.

The storage gate is placed to overlap with a channel formation region ina semiconductor layer included in the transistor.

As a semiconductor for forming a channel of the transistor, a singlecrystal semiconductor, a polycrystalline semiconductor, amicrocrystalline semiconductor, an amorphous semiconductor, or the likecan be used. Examples of a semiconductor material are silicon,germanium, silicon germanium, silicon carbide, and gallium arsenide.Alternatively, an organic semiconductor material or the like may beused.

When an oxide semiconductor is used as a semiconductor for forming thechannel of the transistor, a transistor with an extremely low off-statecurrent can be realized. Thus, a semiconductor device with low powerconsumption can be provided.

In the above semiconductor device, data is written in the followingmanner: the potential of the control gate is set at a potential thatmakes the storage gate a conductor, a potential to be stored in thememory cell is supplied to the storage gate, and the potential of thecontrol gate is set at a potential that makes the storage gate aninsulator.

In the above semiconductor device, data is written in the followingmanner: the potential of the first wiring is set at a potential thatmakes the second gate a conductor, a potential to be stored in thememory cell is supplied to the second gate through the second wiring,and the potential of the first wiring is set at a potential that makesthe second gate an insulator.

In the above semiconductor device, data is read in the following manner:the drain is supplied with (precharged to) electric charge for makingthe drain of the transistor have a first potential, and a change in thepotential of the drain at the time when the potential of the source ofthe transistor is set at a second potential is detected.

In the above semiconductor device, data is read in the following manner:the fourth wiring is supplied with (precharged to) electric charge formaking the fourth wiring have a first potential, and a change in thepotential of the fourth wiring at the time when the potential of thethird wiring is set at a second potential for reading is detected.

Note that in this specification and the like, a non-volatilesemiconductor device indicates a semiconductor device that can retaindata for a given period of time (at least 1×10⁴ seconds or longer,preferably 1×10⁶ seconds or longer) even when no power is supplied.

According to one embodiment of the present invention, the area of asemiconductor device can be reduced; thus, a semiconductor device withhigher integration and larger storage capacity can be provided.

In addition, deterioration of a gate insulating layer hardly occursbecause data writing does not need high voltage; thus, the number ofwrite cycles and the reliability are greatly increased.

Further, an operation for erasing data is not needed, so that high-speedoperation can be easily realized.

Data is stored by making an oxide semiconductor an insulator, so thatthe stored data can be retained for an extremely long time. In otherwords, a refresh operation becomes unnecessary or the frequency ofrefresh operations can be extremely low. Consequently, power consumptionof the semiconductor device can be reduced. Moreover, stored data can beretained for a long time even when power is not supplied.

BRIEF DESCRIPTION OF DRAWINGS

In the accompanying drawings:

FIGS. 1A and 1B are circuit diagrams of a semiconductor device;

FIGS. 2A and 2B are diagrams explaining transient characteristics of acapacitor including an oxide semiconductor;

FIGS. 3A and 3B are timing charts illustrating operations of asemiconductor device;

FIG. 4 is a circuit diagram of a semiconductor device;

FIG. 5A is a plan view and FIGS. 5B and 5C are cross-sectional views ofa semiconductor device;

FIGS. 6A to 6D are cross-sectional views illustrating steps formanufacturing a semiconductor device;

FIGS. 7A and 7B are cross-sectional views of semiconductor devices; and

FIGS. 8A to 8F each illustrate an electronic device including asemiconductor device.

BEST MODE FOR CARRYING OUT THE INVENTION

Examples of embodiments of the present invention will be described belowwith reference to the accompanying drawings. Note that the presentinvention is not limited to the description below, and it is easilyunderstood by those skilled in the art that modes and details can bechanged in various ways without departing from the spirit and scope ofthe present invention. Therefore, the present invention should not beconstrued as being limited to the following description of theembodiments.

A transistor is one of a variety of semiconductor elements, and canamplify current or voltage and perform a switching operation forcontrolling conduction and non-conduction, for example. A transistor inthis specification includes an insulated-gate field effect transistor(IGFET) and a thin film transistor (TFT) in its category.

Note that the position, size, range, and the like of each componentillustrated in drawings and the like are not accurately represented insome cases for easy understanding. Therefore, the disclosed invention isnot necessarily limited to the position, size, range, and the likedisclosed in the drawings and the like.

In this specification, ordinal numbers such as first, second, and thirdare used in order to avoid confusion among components, and the terms donot limit the number of components.

In addition, in this specification, the terms “electrode” and “wiring”do not have functional limitations. For example, an “electrode” issometimes used as part of a “wiring”, and vice versa. Furthermore, theterm “electrode” or “wiring” sometimes refers to a plurality of“electrodes” or “wirings” formed in an integrated manner.

Functions of a “source” and a “drain” are sometimes replaced with eachother when a transistor of opposite polarity is used or when thedirection of current flowing is changed in circuit operation, forexample. Therefore, the terms “source” and “drain” can be replaced witheach other in this specification.

Note that in this specification and the like, the term “electricallyconnected” includes the case where components are connected through anobject having any electric function. There is no particular limitationon an object having any electric function as long as electric signalscan be transmitted and received between components that are connectedthrough the object.

Examples of the object having any electric function are a switchingelement such as a transistor, a resistor, an inductor, a capacitor, andan element with a variety of functions as well as an electrode and awiring.

Note that a voltage refers to a difference between potentials of twopoints, and a potential refers to electrostatic energy (electricpotential energy) of a unit charge at a given point in an electrostaticfield. Note that in general, a difference between a potential of onepoint and a reference potential (e.g., a ground potential) is merelycalled a potential or a voltage, and “potential” and “voltage” are usedas synonymous words in many cases. Therefore, in this specification,“potential” can be replaced with “voltage” and vice versa, unlessotherwise specified.

Embodiment 1

In this embodiment, an example of a circuit configuration and anoperation of a semiconductor device according to one embodiment of thedisclosed invention will be described with reference to FIGS. 1A and 1B,FIGS. 2A and 2B, FIGS. 3A and 3B, and FIG. 4. In this embodiment, thecase where an n-channel transistor (n-type transistor) is used will bedescribed.

FIG. 1A illustrates a circuit configuration of a non-volatile memorycell 200 including a transistor 210. The transistor 210 has a controlgate 211 and a storage gate 212. In FIG. 1A, the control gate 211 of thetransistor 210 is electrically connected to a first wiring 201 (alsoreferred to as a word line WL). The storage gate 212 of the transistor210 is electrically connected to a second wiring 202 (also referred toas a data line DL). One of a source and a drain of the transistor 210 iselectrically connected to a third wiring 203 (also referred to as a readsignal line RL). The other of the source and the drain of the transistor210 is electrically connected to a fourth wiring 204 (also referred toas a bit line BL).

A single crystal semiconductor, a polycrystalline semiconductor, amicrocrystalline semiconductor, an amorphous semiconductor, or the likecan be used as a semiconductor for forming a channel of the transistor210. Examples of a semiconductor material are silicon, germanium,silicon germanium, silicon carbide, and gallium arsenide. The transistor210 including such a semiconductor material can operate at sufficientlyhigh speed, so that stored data can be read at high speed, for example.In other words, high-speed operation of the semiconductor device can berealized.

Alternatively, an oxide semiconductor can be used as a semiconductor forforming the channel of the transistor 210. An oxide semiconductor has awide energy gap of 3.0 eV or more. In a transistor obtained byprocessing an oxide semiconductor under appropriate conditions, theleakage current between a source and a drain in the off state, that is,the off-state current per 1 μm of channel width at an operatingtemperature (e.g., at 25° C.) can be 100 zA (1×10⁻¹⁹ A) or lower or 10zA (1×10⁻²⁰ A) or lower, and further can be 1 zA (1×10⁻²¹ A) or lower.Thus, a semiconductor device with lower power consumption can beprovided.

The storage gate 212 of the transistor 210 is formed using an oxidesemiconductor. It is known that there are an oxide semiconductor thatbecomes n-type when an electric field is applied and an oxidesemiconductor that becomes p-type when an electric field is applied. Inthis specification, the case of using an oxide semiconductor thatbecomes n-type when an electric field is applied will be described as anexample. As an oxide semiconductor used for the storage gate 212, anintrinsic (i-type) or substantially intrinsic oxide semiconductor ispreferably used.

An oxide semiconductor used for the storage gate 212 is not necessarilyan intrinsic (i-type) or substantially intrinsic oxide semiconductor,and any oxide semiconductor that can become intrinsic by application ofan electric field can be used. Note that the intrinsic (i-type) orsubstantially intrinsic oxide semiconductor is intrinsic withoutapplication of an electric field; therefore, in the case of using suchan oxide semiconductor, circuit design can be easy and a semiconductordevice with lower power consumption can be manufactured.

Here, measurement results of transient characteristics of a capacitor300 that includes a stack of an insulator and an oxide semiconductor asa dielectric will be described with reference to FIGS. 2A and 2B. FIG.2A is a schematic diagram illustrating a stacked structure of themeasured capacitor 300.

The capacitor 300 includes an oxide semiconductor 302 and an insulator303 between an electrode 301 and an electrode 304. The electrode 301 isin contact with the oxide semiconductor 302. The electrode 304 is incontact with the insulator 303. As the oxide semiconductor 302, anIn—Ga—Zn—O-based oxide semiconductor with a thickness of 30 nm was used.As the insulator 303, 100-nm-thick silicon oxide was used. The overlaparea of the electrode 301 and the electrode 304 was 1 mm².

The transient current was measured with Agilent 4156C PrecisionSemiconductor Parameter Analyzer (manufactured by Agilent Technologies,Inc.). The measurement was performed as follows. First, the value of acurrent flowing between the electrode 301 and the electrode 304 wasmeasured for 60 seconds while the potential of the electrode 301 is setat 0 V and the potential of the electrode 304 is set at 2 V. Then, thevalue of a current flowing between the electrode 301 and the electrode304 was measured for 60 seconds while the potential of the electrode 301is set at 0 V and the potential of the electrode 304 is set at −2 V.

FIG. 2B shows the measurement results of the transient current. In FIG.2B, the horizontal axis represents voltage application time (measurementtime), and the vertical axis represents the absolute value of thecurrent flowing between the electrode 301 and the electrode 304. A curve311 in FIG. 2B represents a change in the value of the current flowingbetween the electrode 301 and the electrode 304 when a voltage of 2 V isapplied to the electrode 304. A curve 312 represents a change in thevalue of the current flowing between the electrode 301 and the electrode304 when a voltage of −2 V is applied to the electrode 304.

It is understood from the curves 311 and 312 that almost no currentflows between the electrode 301 and the electrode 304 when a voltage of2 V is applied to the electrode 304, and then, when a voltage of −2 V isapplied to the electrode 304, a current which is apparently larger inamount than that in the case where a voltage of 2 V is applied to theelectrode 304 flows between the electrode 301 and the electrode 304 forapproximately 30 seconds after starting application of −2 V. Althoughnot clear in FIG. 2B, it is confirmed that the amount of currentrepresented by the curve 312 is larger than that represented by thecurve 311 even after 30 seconds have passed.

The measurement results of the transient current can be explained asfollows. When a voltage of 2 V is applied to the electrode 304, apositive electric field is applied to the oxide semiconductor 302through the insulator 303, and the oxide semiconductor 302 becomesn-type. The n-type oxide semiconductor 302 is supplied with electriccharge from the electrode 301 and functions as a conductor; thus, onlythe insulator 303 serves as a dielectric layer in the capacitor 300, andalmost no current flows between the electrode 301 and the electrode 304.

Then, when a voltage of −2 V is applied to the electrode 304, the oxidesemiconductor 302 becomes i-type. At this time, electric charge in theoxide semiconductor 302 and near the interface between the electrode 301and the oxide semiconductor 302 moves toward the electrode 301immediately. On the other hand, electric charge in the oxidesemiconductor 302 and away from the electrode 301 cannot moveimmediately but moves slowly because of effects of electric field driftcaused by application of −2 V to the electrode 304.

The oxide semiconductor has a wide energy gap of 3.0 eV or more.Moreover, the intrinsic (i-type) or substantially intrinsic oxidesemiconductor has a sufficiently low carrier density (e.g., lower than1×10¹²/cm³, or lower than 1.45×10¹⁰/cm³) as compared to the carrierdensity of a general silicon wafer (approximately 1×10¹⁴/cm³).

A semiconductor such as general silicon becomes n-type when a positiveelectric field is applied and becomes p-type when a negative electricfield is applied. That is, such a semiconductor always serves as aconductor when an electric field is applied. On the other hand, an oxidesemiconductor becomes n-type when a positive electric field is appliedbut remains i-type when a negative electric field is applied.

It is therefore likely that an oxide semiconductor serves as one of aconductor and an insulator in accordance with an electric field appliedthereto and electric charge applied when the oxide semiconductor servesas a conductor can be retained even after the oxide semiconductorbecomes an insulator.

Using the above properties of the oxide semiconductor, it is possible torealize a storage element in which writing and reading of data can beperformed at high speed with lower voltage than a conventional element.

Next, an example of a write operation (write mode) and a read operation(read mode) for storing two-value data (e.g., data of 0 or 1) in thesemiconductor device disclosed in this embodiment will be described withreference to timing charts of FIGS. 3A and 3B. The timing charts ofFIGS. 3A and 3B show changes over time in potentials or states of thecomponents illustrated in FIG. 1A. In this embodiment, an operation ofstoring a high-level potential V_(DLH) or a low-level potential V_(DLL)in the memory cell 200 as two-value data and an operation of reading thestored data will be described.

In FIGS. 3A and 3B, the first wiring 201 (the word line WL) is suppliedwith a high-level potential V_(WLH) or a low-level potential V_(WLL).The second wiring 202 (the data line DL) is supplied with a high-levelpotential V_(DLH) or a low-level potential V_(DLL). The third wiring 203(the read signal line RL) is supplied with a high-level potentialV_(RLH) or a low-level potential V_(RLL). The fourth wiring 204 (the bitline BL) is supplied with a high-level potential V_(BLH) or a low-levelpotential V_(BLL).

The potential of the storage gate 212 after the storage gate 212 becomesan insulator by V_(DLH) written thereto is denoted by V_(MLH). Thepotential of the storage gate 212 after the storage gate 212 becomes aninsulator by V_(DLL) written thereto is denoted by V_(MLL). Thepotential of the storage gate 212 at the time of a read operation in thecase where V_(DLH) has been written into the storage gate 212 in a writeoperation is denoted by V_(MLHR). The potential of the storage gate 212at the time of a read operation in the case where V_(DLL) has beenwritten into the storage gate 212 in a write operation is denoted byV_(MLLR).

In FIGS. 3A and 3B, a voltage (hereinafter referred to as V_(thos)) thatmakes the storage gate 212 (indicated by ML in FIGS. 3A and 3B) formedusing an oxide semiconductor a conductor (n-type) is assumed to be 1 V,and V_(WLH) is set at 4 V and V_(WLL) at −1 V. V_(DLH) is set at 2 V;V_(DLL), 0 V; V_(RLH), 0 V; V_(RLL), −5 V; V_(BLH), 0 V; and V_(BLL), −5V.

Note that in this embodiment, V_(MLH) is 0 V and V_(MLL) is −1 V.Furthermore, V_(MLHR) is −2.5 V and V_(MLLR) is −3.5 V. The thresholdvoltage of the transistor 210 (indicated by TR in FIGS. 3A and 3B) is 2V.

The insulated storage gate 212 is electrically floating (in a floatingstate). For that reason, when the potential of the first wiring 201 (theword line WL), the third wiring 203 (the read signal line RL), or thefourth wiring 204 (the bit line BL) is varied, the potential of theinsulated storage gate 212 is varied accordingly.

The amount of the change in the potential of the insulted storage gate212 is determined by the ratio of a capacitance (hereinafter “C_(CM)”)generated between the control gate 211 to which the first wiring 201(the word line WL) is electrically connected and the storage gate 212 toa capacitance (hereinafter “C_(MS)”) generated between the storage gate212 and a channel formation region of the transistor 210.

For example, in the case where the value of C_(CM) is sufficientlylarger than that of C_(MS), when the potential of the channel formationregion is fixed and the potential of the control gate 211 is changed,the potential of the insulated storage gate 212 is changed byapproximately the same amount as the change in the potential of thecontrol gate 211.

In the case where the value of C_(CM) is sufficiently smaller than thatof C_(MS), when the potential of the channel formation region is fixedand the potential of the control gate 211 is changed, the potential ofthe insulated storage gate 212 is hardly changed.

In the case where the value of C_(CM) is the same as that of C_(MS),when the potential of the channel formation region is fixed and thepotential of the control gate 211 is changed, the potential of theinsulated storage gate 212 is changed by only half the amount of thechange in the potential of the control gate 211.

The potential of the channel formation region of the transistor 210 canbe fixed by fixing the potentials of the third wiring 203 (the readsignal line RL) and the fourth wiring 204 (the bit line BL) which areconnected to the transistor 210.

For example, in order to prevent the potential of the insulated storagegate 212 in a floating state from being affected by the change in thepotentials of the third wiring 203 (the read signal line RL) and thefourth wiring 204 (the bit line BL) as much as possible, the value ofC_(CM) is preferably 2 times or more, further preferably 5 times ormore, still preferably 10 times or more that of C_(MS).

Further, in order to minimize effects of the change in potentials of allthe wirings connected to the transistor 210 on the potential of theinsulated storage gate 212 in a floating state, the value of C_(CM) ispreferably 0.5 times or more and less than 2 times, further preferably0.7 times or more and less than 1.5 times that of C_(MS).

In this embodiment, the case where the value of C_(CM) is the same asthat of C_(MS) is described.

First, a write (rewrite) operation of data into the memory cell 200 willbe described. Here, an operation for holding the high-level potentialV_(MLH) in the storage gate 212 is described. First, as a firstoperation, the high-level potential V_(WLH) (4 V) is applied to thefirst wiring 201 (the word line WL) connected to the memory cell 200that is selected to be subjected to data writing, and the high-levelpotential V_(DLH) (2 V) is applied to the second wiring 202 (the dataline DL).

When the high-level potential V_(WLH) is applied to the first wiring 201(the word line WL), the potential of the control gate 211 becomes thehigh-level potential V_(WLH). Accordingly, the potential differencebetween the second wiring 202 (the data line DL) and the control gate211, with the second wiring 202 (the data line DL) as a reference,becomes 2V. In other words, the potential difference is more thanV_(thos) (1 V); thus, the storage gate 212 becomes a conductor and thepotential of the second wiring 202 (the data line DL) is supplied to thestorage gate 212. That is, the potential of the storage gate 212 becomesthe high-level potential V_(DLH) (2 V).

Then, as a second operation, the low-level potential V_(WLL) (−1 V) isapplied to the first wiring 201 (the word line WL). At this time, thepotential of the second wiring 202 (the data line DL) is set to remainat the high-level potential V_(DLH). When the low-level potentialV_(WLL) is applied to the first wiring 201 (the word line WL), thepotential of the control gate 211 becomes the low-level potentialV_(WLL). Accordingly, the potential difference between the second wiring202 (the data line DL) and the control gate 211, with the second wiring202 (the data line DL) as a reference, becomes −3 V; thus, the storagegate 212 becomes an insulator.

Since V_(thos) is 1 V, the storage gate 212 serves as a conductor and issupplied with the high-level potential V_(DLH) when the differencebetween the potential of the first wiring 201 (the potential of thecontrol gate 211) and the potential of the second wiring 202 (the dataline DL) is more than 1 V (i.e., during the first operation). When thedifference between the potential of the first wiring 201 (the potentialof the control gate 211) and the potential of the second wiring 202 (thedata line DL) becomes less than 1 V by the second operation, the storagegate 212 becomes an insulator to exist in a floating state.Consequently, the potential of the storage gate 212 is changed by theinfluence of the change in the potential of the first wiring 201 (theword line WL) corresponding to the ratio of C_(CM) to C_(MS).

Formula 1 represents the potential V_(MLH) of the storage gate 212 afterthe high-level potential V_(DLH) is supplied to the storage gate 212 andthe potential of the control gate 211 is changed from the high-levelpotential V_(WLH) to the low-level potential V_(WLL).

$\begin{matrix}{V_{MLH} = {V_{DLH} - {\frac{C_{CM}}{C_{CM} + C_{MS}}( {V_{DLH} + V_{thos} - V_{WLL}} )}}} & \lbrack {{Formula}\mspace{14mu} 1} \rbrack\end{matrix}$

In order to hold the low-level potential V_(MLL) in the storage gate212, the low-level potential V_(DLL) is supplied to the second wiring202 (the data line DL) and the same write operation as above isperformed. Formula 2 represents the potential V_(MLL) of the storagegate 212 after the low-level potential V_(DLL) is supplied to thestorage gate 212 and the potential of the control gate 211 is changedfrom the high-level potential V_(WLH) to the low-level potentialV_(WLL).

$\begin{matrix}{V_{MLL} = {V_{DLL} - {\frac{C_{CM}}{C_{CM} + C_{MS}}( {V_{DLL} + V_{thos} - V_{WLL}} )}}} & \lbrack {{Formula}\mspace{14mu} 2} \rbrack\end{matrix}$

That is, the high-level potential V_(MLH) is 0 V and the low-levelpotential V_(MLL) is −1 V in this embodiment.

When the storage gate 212 serves as an insulator, electric charge in thestorage gate 212 cannot move. For that reason, the potential of thestorage gate 212 can be kept at the high-level potential V_(MLH) or thelow-level potential V_(MLL) even when the potential of the second wiring202 connected to the storage gate 212 is changed. In such a manner, thehigh-level potential V_(DLH) written into the storage gate 212 is storedas the high-level potential V_(MLH), and the low-level potential V_(DLL)is stored as the low-level potential V_(MLL).

Note that in the write operation, the potential of the third wiring 203(the read signal line RL) is set at V_(RLH) (0 V) and the potential thefourth wiring 204 (the bit line BL) at V_(BLH) (0 V).

It is preferable that both the high-level potential V_(MLH) and thelow-level potential V_(MLL) which are stored in the storage gate 212 bea potential at which the transistor 210 is off. In particular, in a readoperation in the case where a plurality of memory cells 200 areconnected, a malfunction of a memory cell that is not subjected to datareading is prevented and data can be accurately read, resulting inimproving the reliability of the semiconductor device.

Next, an operation of reading data stored in the memory cell 200 will bedescribed. FIG. 3B is a timing chart of the operation in the read mode.Here, an operation in the case where the high-level potential V_(MLH) isheld in the storage gate 212 is described.

First, as a first operation, electric charge is supplied to the fourthwiring 204 (the bit line BL) so that the potential of the fourth wiring204 (the bit line BL) is set at the high-level potential V_(BLH) (thisoperation is called precharge). At this time, the potential of the firstwiring 201 (the word line WL) is set to remain at the low-levelpotential V_(WLL). There is no particular limitation on the potential ofthe second wiring 202 (the data line DL); here, the second wiring 202has the high-level potential V_(DLH). Note that the high-level potentialV_(BLH) and the low-level potential V_(RLL) are different from eachother.

Then, as a second operation, the potential of the third wiring 203 (theread signal line RL) is set at the low-level potential V_(RLL). At thistime, since the storage gate 212 is in a floating state, the potentialof the storage gate 212 is affected by the change in the potential ofthe third wiring 203 (the read signal line RL) corresponding to theratio of C_(CM) to C_(MS).

In the case where the storage gate 212 stores the high-level potentialV_(MLH), when the potential of the third wiring 203 (the read signalline RL) is changed from the high-level potential V_(RLH) to thelow-level potential V_(RLL), the potential V_(MLHR) of the storage gate212 can be represented by Formula 3.

$\begin{matrix}{V_{MLHR} = {V_{MLH} - {\frac{C_{CM}}{C_{CM} + C_{MS}}( {V_{RLH} - V_{RLL}} )}}} & \lbrack {{Formula}\mspace{14mu} 3} \rbrack\end{matrix}$

In other words, the potential V_(MLHR) is −2.5 V in this embodiment.Since the low-level potential V_(RLL) is −5 V at this time, thegate-source voltage of the transistor 210 is obtained in the followingmanner: V_(MLHR)−V_(RLL)=−2.5 V−(−5 V)=2.5 V. That is, the gate-sourcevoltage is larger than the threshold voltage (2 V) of the transistor210; thus, the transistor 210 is turned on.

When the transistor 210 is turned on, the potential of the third wiring203 (the read signal line RL) is supplied to the fourth wiring 204 (thebit line BL) through the transistor 210, so that the potential of thefourth wiring 204 (the bit line BL) is changed.

In the case where the storage gate 212 stores the low-level potentialV_(MLL), when the potential of the third wiring 203 (the read signalline RL) is changed from the high-level potential V_(RLH) to thelow-level potential V_(RLL), the potential V_(MLLR) of the storage gate212 can be represented by Formula 4.

$\begin{matrix}{V_{MLLR} = {V_{MLL} - {\frac{C_{CM}}{C_{CM} + C_{MS}}( {V_{RLH} - V_{RLL}} )}}} & \lbrack {{Formula}\mspace{14mu} 4} \rbrack\end{matrix}$

In other words, the potential V_(MLLR) is −3.5 V in this embodiment.Since the low-level potential V_(RLL) is −5 V at this time, thegate-source voltage of the transistor 210 is obtained in the followingmanner: V_(MLLR)−V_(RLL)=−3.5 V−(−5 V)=1.5 V. That is, the gate-sourcevoltage cannot exceed the threshold voltage (2 V) of the transistor 210.In that case, the transistor 210 remains off, and the potential of thefourth wiring 204 (the bit line BL) is not changed.

In such a manner, data stored in the storage gate 212 can be read bydetecting a change in the potential of the fourth wiring 204 (the bitline BL) caused by changing the potential of the third wiring 203 (theread signal line RL) to the low-level potential V_(RLL).

Data (electric charge) held in the storage gate 212 is retained untilthe data is rewritten with new data in a write mode. The insulated oxidesemiconductor has high resistivity and electric charge hardly movestherein; thus, the potential of the storage gate 212 can be retained foran extremely long time.

Note that in a flash memory, it is necessary to keep a proper distancebetween cells in order to prevent the potential of a control gate fromadversely affecting a floating gate of an adjacent cell. This is one offactors inhibiting higher integration of the semiconductor device. Thefactor is attributed to the following basic principle of a flash memory:tunneling current is generated by application of a high electric field.

Further, because of the above principle of a flash memory, deteriorationof an insulating film proceeds, which causes a limitation on the writecycles (approximately 10000 cycles).

The semiconductor device according to the invention disclosed hereindoes not use the above principle of charge injection by tunnelingcurrent. That is, unlike a flash memory, a high electric field forcharge injection is not necessary. Consequently, it is not necessary toconsider an influence of a high electric field from a control gate on anadjacent cell, which facilitates high integration.

Further, since charge injection by tunneling current is not used, thereis no cause for deterioration of a memory cell. In other words, thesemiconductor device according to the disclosed invention has higherdurability and reliability than a flash memory.

In addition, the semiconductor device according to the disclosedinvention has advantages over a flash memory in that a high electricfield is not necessary and a large peripheral circuit (such as a boostercircuit) is not necessary.

Note that an n-channel transistor in which electrons are majoritycarriers is used in the above description; it is needless to say that ap-channel transistor in which holes are majority carriers can be usedinstead of the n-channel transistor. In the case of using p-channeltransistors, potentials supplied to the wirings are set on the basis ofthe above-described operation principle.

FIG. 1B illustrates an example of a circuit diagram of a semiconductordevice with a memory capacity of m×n bits, including the semiconductordevices (the memory cells) illustrated in FIG. 1A. FIG. 1B is a circuitdiagram of a NOR semiconductor device in which memory cells 1200 areconnected in parallel.

The semiconductor device illustrated in FIG. 1B includes a memory cellarray and peripheral circuits such as a first driver circuit 1221, asecond driver circuit 1222, a third driver circuit 1223, and a fourthdriver circuit 1224. The memory cell array includes m word lines WL, mread signal lines RL, n bit lines BL, n data lines DL, and a pluralityof memory cells 1200 that are arranged in a matrix of m rows (in thevertical direction) and n columns (in the horizontal direction) (m and nare natural numbers). Here, the structure illustrated in FIG. 1A isapplied to the memory cell 1200.

Each of the memory cells 1200 includes a transistor 1210. The transistor1210 has a control gate 1211 and a storage gate 1212. The control gate1211 is electrically connected to the word line WL. The storage gate1212 is electrically connected to the data line DL. One of a source anda drain of the transistor 1210 is electrically connected to the readsignal line RL. The other of the source and the drain of the transistor1210 is electrically connected to the bit line BL.

A memory cell 1200 (i,j) of an i-th row and a j-th column (i is aninteger of 1 to m and j is an integer of 1 to n) is electricallyconnected to a read signal line RL_i, a bit line BL_j, and a word signalline WL_i.

The word lines WL are electrically connected to the first driver circuit1221. The data lines DL are electrically connected to the second drivercircuit 1222. The read signal lines RL are electrically connected to thethird driver circuit 1223. The bit lines BL are electrically connectedto the fourth driver circuit 1224. Note that the first driver circuit1221, the second driver circuit 1222, the third driver circuit 1223, andthe fourth driver circuit 1224 are separately provided here;alternatively, a decoder having one or a plurality of their functionsmay be used.

Although data can be written into the memory cell 1200 with theabove-described write operation, when V_(WLH) is applied to a given wordline WL, the storage gates 1212 of the all the transistors 1210connected to the word line WL become conductors. Thus, when data issequentially written into the memory cells 1200 one by one, data in thememory cell in which the write operation has finished might be changed.For that reason, in the write operation, it is preferable that data beconcurrently written into all the memory cells connected to a selectedword line WL.

Data can be read from the memory cell 1200 with the above-described readoperation. Since data stored in the memory cell 1200 is a potential atwhich the transistor 1210 is off, data can be read from given memorycells 1200 one by one. Moreover, it is possible to concurrently readdata in all the memory cells 1200 connected to the read signal line RL.

Note that an n-channel transistor (n-type transistor) in which electronsare majority carriers is used in the above description; it is needlessto say that a p-channel transistor in which holes are majority carrierscan be used instead of the n-channel transistor. In the case of usingp-channel transistors, potentials supplied to the wirings are set on thebasis of the above operation principle.

The semiconductor device disclosed in this embodiment does not include acapacitor that is needed for a DRAM in terms of the operation principle;therefore, the area per unit memory cell can be reduced and integrationof the memory cells can be increased. For example, given that theminimum feature size is F, the area of a memory cell can be 15F² to25F².

In addition, in the semiconductor device disclosed in this embodiment,stored electric charge hardly moves because data is stored by making anoxide semiconductor an insulator. Thus, a refresh operation needed for aconventional DRAM can be unnecessary or performed much less often (e.g.,about once a month or a year), so that power consumption of thesemiconductor device can be sufficiently reduced.

Further, in the semiconductor device disclosed in this embodiment, datacan be directly rewritten by rewriting of new data to a memory cell. Forthat reason, an erase operation which is necessary for a flash memory orthe like is not needed, so that a reduction in operation speed due tothe erase operation can be prevented. That is, high-speed operation ofthe semiconductor device can be realized. Moreover, a high voltagenecessary for a conventional floating gate transistor to write and erasedata is unnecessary; thus, power consumption of the semiconductor devicecan be further reduced.

FIG. 4 schematically illustrates a reading circuit for reading datastored in a memory cell. The reading circuit includes a transistor and asense amplifier circuit.

At the time of reading data, a terminal A is connected to a bit line BLto which a memory cell subjected to data reading is connected.Furthermore, a bias potential Vbias is applied to a gate electrode ofthe transistor so that the potential of the terminal A is controlled.

The sense amplifier circuit outputs high data when the potential of theterminal A is higher than a reference potential Vref (e.g., 0 V) andoutputs low data when the potential of the terminal A is lower than thereference potential Vref. Specifically, first, the transistor is turnedon, and the bit line BL connected to the terminal A is precharged to thepotential V_(BLH). Next, the memory cell subjected to data reading isset to a read mode, and the potential of the bit line BL connected tothe terminal A is compared with the reference potential Vref.Accordingly, high data or low data is output as output data inaccordance with the data stored in the memory cell.

By using the reading circuit in the above manner, data stored in thememory cell can be read. Note that the reading circuit of thisembodiment is an example; another known circuit may be used.

The methods and structures described in this embodiment can be combinedas appropriate with any of the methods and structures described in theother embodiments.

Embodiment 2

In this embodiment, an example of a structure and a manufacturing methodof the semiconductor device described in Embodiment 1 will be describedwith reference to FIGS. 5A to 5C, FIGS. 6A to 6D, and FIGS. 7A and 7B.

<Cross-Sectional Structure and Planar Structure of Semiconductor Device>

FIGS. 5A to 5C illustrate an example of a transistor 150 that can beused as a storage element. FIG. 5A illustrates a planar structure of thetransistor 150. FIG. 5B illustrates a cross section along X1-X2 in FIG.5A. FIG. 5C is an enlarged view of a portion 180 in FIG. 5B.

In the transistor 150, a base insulating layer 110 is provided over asubstrate 100. A control gate 101 is provided over the base insulatinglayer 110. A first gate insulating layer 102 is provided over thecontrol gate 101. An electrode 103 is provided over the first gateinsulating layer 102. A storage gate 104 is provided in contact with thefirst gate insulating layer 102 and the electrode 103. A second gateinsulating layer 105 is provided over the storage gate 104. Asemiconductor layer 106 is provided over the second gate insulatinglayer 105. A source electrode 107 a and a drain electrode 107 b areprovided over the semiconductor layer 106. An insulating layer 108 isprovided over the semiconductor layer 106, the source electrode 107 a,and the drain electrode 107 b. A protective insulating layer 109 isprovided over the insulating layer 108. The transistor 150 has abottom-gate structure and an inverted staggered structure.

The electrode 103 is provided in contact with part of the storage gate104 and supplies data to be stored to the storage gate 104. The storagegate 104 is sandwiched between the first gate insulating layer 102 andthe second gate insulating layer 105. Moreover, the storage gate 104 isin contact with the first gate insulating layer 102 and the second gateinsulating layer 105 at least in a region overlapping with a channelformation region of the semiconductor layer 106 (i.e., a region in thesemiconductor layer 106, placed between the source electrode 107 a andthe drain electrode 107 b). The electrode 103 and the storage gate 104are connected to each other at a position which does not overlap withthe channel formation region of the semiconductor layer 106.

The control gate 101 is positioned to overlap with the storage gate 104and the channel formation region of the semiconductor layer 106. Thestorage gate 104 is placed between the control gate 101 and thesemiconductor layer 106.

An edge 181 illustrated in FIG. 5C is an edge of the electrode 103 in aregion where the electrode 103 is in contact with the storage gate 104.The control gate 101 is provided to overlap with the storage gate 104and further overlaps with at least a region from the channel formationregion of the semiconductor layer 106 to the edge 181. With the abovestructure, when the storage gate 104 is made to be a conductor byapplying a voltage to the control gate 101, the region which overlapswith the semiconductor layer 106 and the region from the channelformation region to the portion in contact with the electrode 103 can bemade to be a conductor, and data can be accurately written into thestorage gate 104. The control gate 101 is preferably provided to overlapwith the electrode 103 beyond the edge 181.

<Method for Manufacturing Semiconductor Device>

Next, an example of a method for manufacturing the transistor 150 willbe described with reference to FIGS. 6A to 6D. Note that unlessotherwise specified, a photolithography process in this specificationincludes a step of forming a resist mask, a step of etching a conductivelayer or an insulating layer, and a step of separating the resist mask.

First, the base insulating layer 110 and a conductive layer are formedover the substrate 100. Then, through a first photolithography process,the conductive layer (as well as a wiring formed from the conductivelayer) is partly removed by etching, and the control gate 101 is formed.Note that a resist mask may be formed by an inkjet method. Formation ofa resist mask by an inkjet method needs no photomask; thus,manufacturing costs can be reduced.

There is no particular limitation on a substrate that can be used as thesubstrate 100, and a glass substrate, a ceramic substrate, a quartzsubstrate, a sapphire substrate, a crystallized glass substrate, or thelike can be used.

Alternatively, a flexible substrate may be used as the substrate 100. Inthe case of using a flexible substrate, a transistor may be directlyformed over a flexible substrate; alternatively, a transistor may beformed over another substrate and then separated from the substrate andtransferred to a flexible substrate. Note that in order to separate thetransistor from the substrate and transfer it to the flexible substrate,a separation layer is preferably provided between the substrate and thetransistor.

The base insulating layer 110 can be formed with a single-layerstructure or a stacked structure using at least one of the followinginsulating layers: an aluminum nitride layer, an aluminum oxide layer,an aluminum oxynitride layer, an aluminum nitride oxide layer, a siliconnitride layer, a silicon oxide layer, a silicon nitride oxide layer, anda silicon oxynitride layer. The base insulating layer 110 has a functionof preventing diffusion of an impurity element from the substrate 100.

When a halogen element such as chlorine or fluorine is contained in thebase insulating layer 110, a function of preventing diffusion of animpurity element from the substrate 100 can be further improved. Thepeak of the concentration of a halogen element contained in the baseinsulating layer 110, measured by secondary ion mass spectrometry(SIMS), is preferably higher than or equal to 1×10¹⁵/cm³ and lower thanor equal to 1×10²⁰/cm³.

The base insulating layer 110 may be formed using gallium oxide.Alternatively, the base insulating layer 110 may have a stackedstructure of a gallium oxide layer and any of the above insulatinglayers. Gallium oxide is a material that is hardly charged, and thus cansuppress variation in threshold voltage due to charge build-up of theinsulating layer. Note that the base insulating layer 110 is notnecessarily provided.

The control gate 101 can be formed with a single-layer structure or astacked structure using a metal material such as molybdenum (Mo),titanium (Ti), tantalum (Ta), tungsten (W), aluminum (Al), copper (Cu),chromium (Cr), neodymium (Nd), scandium (Sc), or magnesium (Mg) or analloy material containing any of these materials as a main component.

Then, the first gate insulating layer 102 is formed over the controlgate 101 (see FIG. 6A). The first gate insulating layer 102 can beformed using silicon oxide, silicon nitride, silicon oxynitride, siliconnitride oxide, aluminum oxide, aluminum nitride, aluminum oxynitride,aluminum nitride oxide, tantalum oxide, gallium oxide, yttrium oxide,hafnium oxide, hafnium silicate (HfSi_(x)O_(y) (x>0, y>0)), hafniumsilicate to which nitrogen is added (HfSi_(x)O_(y)N_(z) (x>0, y>0,z>0)), hafnium aluminate to which nitrogen is added (HfAl_(x)O_(y)N_(z)(x>0, y>0, z>0)), or the like by plasma CVD, sputtering, or the like.The first gate insulating layer 102 is not limited to a single layer andmay be a stack of different layers. For example, the first gateinsulating layer 102 may be formed in the following manner: a siliconnitride layer (SiN_(y) (y>0)) is formed by plasma CVD as a gateinsulating layer A and a silicon oxide layer (SiO_(x) (x>0)) is stackedover the gate insulating layer A as a gate insulating layer B.

Other than sputtering and plasma CVD, the first gate insulating layer102 can be formed by, for example, high-density plasma CVD usingmicrowaves (e.g., a frequency of 2.45 GHz).

In particular, the first gate insulating layer 102 is preferably formedusing an insulating material containing the same kind of component asthe oxide semiconductor that is formed later. Such a material iscompatible with the oxide semiconductor, and the use of such a materialfor the first gate insulating layer 102 can keep the interface statebetween the oxide semiconductor and the first gate insulating layer 102favorable. Here, “the same kind of component as the oxide semiconductor”means one or more of elements selected from constituent elements of theoxide semiconductor. For example, in the case where the oxidesemiconductor is formed using an In—Ga—Zn-based oxide semiconductormaterial, gallium oxide is given as an insulating material containingthe same kind of component as the oxide semiconductor.

In the case of employing a stacked structure, the first gate insulatinglayer 102 may have a stacked structure of a film formed using aninsulating material containing the same kind of component as the oxidesemiconductor and a film formed using a material different from that ofthe film.

Next, a conductive layer is formed over the first gate insulating layer102. Then, through a second photolithography process, the conductivelayer is partly removed by etching, and the electrode 103 (as well as awiring formed from the same layer as the electrode 103) is formed. Notethat a resist mask may be formed by an inkjet method. Formation of aresist mask by an inkjet method needs no photomask; thus, manufacturingcosts can be reduced.

For the conductive layer used for the electrode 103, a metal containingan element selected from Al, Cr, Cu, Ta, Ti, Mo, W, Nd, Sc, and Mg, ametal nitride containing any of the above elements as a component (e.g.,titanium nitride, molybdenum nitride, or tungsten nitride), or the likecan be used, for example. The electrode 103 may have a structure inwhich a refractory metal layer of Ti, Mo, W, or the like or a metalnitride layer of any of these elements (e.g., a titanium nitride layer,a molybdenum nitride layer, or a tungsten nitride layer) is stacked onone or both of a bottom surface and a top surface of a metal layer ofAl, Cu, or the like.

Next, an oxide semiconductor layer with a thickness of 2 nm to 200 nm,preferably 5 nm to 30 nm is formed over the electrode 103 and the firstgate insulating layer 102.

In order that hydrogen, a hydroxyl group, and moisture may be containedin the oxide semiconductor layer as little as possible, it is preferablethat the substrate 100 where the electrode 103 and the first gateinsulating layer 102 are formed be subjected to preheating in apreheating chamber of a sputtering apparatus as pretreatment for formingthe oxide semiconductor layer so that impurities such as hydrogen andmoisture adsorbed on the substrate 100 are removed and exhausted. As anexhaustion unit provided in the preheating chamber, a cryopump ispreferably employed. Note that this preheating treatment can be omitted.Further, before the insulating layer 108 is formed, this preheating maybe similarly performed on the substrate 100 over which components up toand including the source electrode 107 a and the drain electrode 107 bare formed.

As an oxide semiconductor used for the oxide semiconductor layer, any ofthe following oxide semiconductors can be used, for example: an oxide offour metal elements, such as an In—Sn—Ga—Zn—O-based oxide semiconductor;an oxide of three metal elements, such as an In—Ga—Zn—O-based oxidesemiconductor, an In—Sn—Zn—O-based oxide semiconductor, anIn—Al—Zn—O-based oxide semiconductor, a Sn—Ga—Zn—O-based oxidesemiconductor, an Al—Ga—Zn—O-based oxide semiconductor, aSn—Al—Zn—O-based oxide semiconductor, an In—Hf—Zn—O-based oxidesemiconductor, an In—La—Zn—O-based oxide semiconductor, anIn—Ce—Zn—O-based oxide semiconductor, an In—Pr—Zn—O-based oxidesemiconductor, an In—Nb—Zn—O-based oxide semiconductor, anIn—Pm—Zn—O-based oxide semiconductor, an In—Sm—Zn—O-based oxidesemiconductor, an In—Eu—Zn—O-based oxide semiconductor, anIn—Gd—Zn—O-based oxide semiconductor, an In—Tb—Zn—O-based oxidesemiconductor, an In—Dy—Zn—O-based oxide semiconductor, anIn—Ho—Zn—O-based oxide semiconductor, an In—Er—Zn—O-based oxidesemiconductor, an In—Tm—Zn—O-based oxide semiconductor, anIn—Yb—Zn—O-based oxide semiconductor, and an In—Lu—Zn—O-based oxidesemiconductor; an oxide of two metal elements, such as an In—Zn—O-basedoxide semiconductor, a Sn—Zn—O-based oxide semiconductor, anAl—Zn—O-based oxide semiconductor, a Zn—Mg—O-based oxide semiconductor,a Sn—Mg—O-based oxide semiconductor, an In—Mg—O-based oxidesemiconductor, and an In—Ga—O-based oxide semiconductor; an In—O-basedoxide semiconductor; a Sn—O-based oxide semiconductor; and a Zn—O-basedoxide semiconductor. Further, SiO₂ may be contained in the above oxidesemiconductor.

The oxide semiconductor layer preferably includes In, more preferably Inand Ga. Dehydration or dehydrogenation is effective in order to obtainan i-type (intrinsic) oxide semiconductor layer.

Here, for example, an In—Ga—Zn—O-based oxide semiconductor refers to anoxide containing indium (In), gallium (Ga), and zinc (Zn), and there isno limitation on the composition ratio thereof. The In—Ga—Zn—O-basedoxide semiconductor may contain an element other than In, Ga, and Zn.

For the oxide semiconductor layer, a thin film expressed by a chemicalformula of InMO₃(ZnO)_(m) (m>0) can be used. Here, M represents one ormore of metal elements selected from Ga, Al, Mn, and Co. For example, Mcan be Ga, Ga and Al, Ga and Mn, or Ga and Co.

In this embodiment, the oxide semiconductor layer is formed bysputtering using an In—Ga—Zn—O-based oxide target. The oxidesemiconductor layer can be formed by sputtering under a rare gas(typically argon) atmosphere, an oxygen atmosphere, or a mixedatmosphere of a rare gas and oxygen.

As a target for forming the oxide semiconductor layer by sputtering, forexample, an oxide target having a composition ratio ofIn₂O₃:Ga₂O₃:ZnO=1:1:1 [molar ratio] is used to form an In—Ga—Zn—O layer.Without limitation to the material and the composition of the target, anoxide target having a composition ratio of In₂O₃:Ga₂O₃:ZnO=1:1:2 [molarratio] may be used, for example.

In the case where an In—Zn—O-based material is used for the oxidesemiconductor layer, a target used has a composition ratio of In:Zn=50:1to 1:2 in an atomic ratio (In₂O₃:ZnO=25:1 to 1:4 in a molar ratio),preferably In:Zn=20:1 to 1:1 in an atomic ratio (In₂O₃:ZnO=10:1 to 1:2in a molar ratio), further preferably In:Zn=15:1 to 1.5:1(In₂O₃:ZnO=15:2 to 3:4 in a molar ratio). For example, when a targetused for forming an In—Zn—O-based oxide semiconductor layer has anatomic ratio of In:Zn:O=X:Y:Z, the relation of Z>1.5X+Y is satisfied.

The filling rate of the oxide target is 90% to 100%, preferably 95% to99.9%. With the use of a metal oxide target with a high filling rate, adense oxide semiconductor layer can be deposited.

It is preferable that a high-purity gas from which impurities such ashydrogen, water, a compound having a hydroxyl group, and hydride areremoved be used as a sputtering gas for forming the oxide semiconductorlayer.

When the oxide semiconductor layer is formed, the substrate is held in adeposition chamber kept under a reduced pressure and the substratetemperature is set at 100° C. to 600° C., preferably 300° C. to 500° C.By heating the substrate during deposition, the impurity concentrationin the oxide semiconductor layer can be reduced. In addition, damage bysputtering is reduced. Then, a sputtering gas from which hydrogen andmoisture are removed is introduced into the deposition chamber whilemoisture remaining therein is removed, and the oxide semiconductor layeris formed with the use of the above target.

In order to remove moisture remaining in the deposition chamber, anentrapment vacuum pump such as a cryopump, an ion pump, or a titaniumsublimation pump is preferably used. As an exhaustion unit, a turbomolecular pump provided with a cold trap may be used. In the depositionchamber evacuated with a cryopump, a hydrogen atom, a compoundcontaining a hydrogen atom, such as water (H₂O) (preferably, also acompound containing a carbon atom), and the like are evacuated, so thatthe concentration of impurities in the oxide semiconductor layer formedin the deposition chamber can be reduced.

An example of the deposition conditions is as follows: the distancebetween the substrate and the target is 100 mm, the pressure is 0.6 Pa,the power of the DC power source is 0.5 kW, and the atmosphere is anoxygen atmosphere (the flow rate of oxygen is 100%). Note that it ispreferable to use a pulsed direct-current power source because powdersubstances (also referred to as particles or dust) generated duringdeposition can be reduced and the film thickness can be uniform.

Next, first heat treatment is performed. With the first heat treatment,excessive hydrogen (including water and a hydroxyl group) in the oxidesemiconductor layer is removed (dehydration or dehydrogenation) and thestructure of the oxide semiconductor layer is ordered, so that defectlevels in the energy gap can be reduced. Moreover, defects caused at theinterface between the oxide semiconductor layer and the insulating layerin contact with the oxide semiconductor layer can be reduced.

The first heat treatment is performed at a temperature in the range of250° C. to 750° C. or at a temperature higher than or equal to 400° C.and lower than the strain point of the substrate in a reduced pressureatmosphere, an inert gas atmosphere such as a nitrogen atmosphere or arare gas atmosphere, an oxygen gas atmosphere, or an ultra-dry air (witha moisture content of 20 ppm (equivalent to a dew point of −55° C.) orlower, preferably 1 ppm or lower, further preferably 10 ppb or lowerwhen measured with a dew-point meter using cavity ring-down laserspectroscopy (CRDS)). For example, the substrate is put in an electricfurnace which is a kind of heat treatment apparatus, and the oxidesemiconductor layer is subjected to heat treatment at 450° C. for onehour in a nitrogen atmosphere.

Note that a heat treatment apparatus is not limited to an electricalfurnace, and may include a device for heating an object to be processedby heat conduction or heat radiation from a heating element such as aresistance heating element. For example, an RTA (rapid thermal anneal)apparatus such as a GRTA (gas rapid thermal anneal) apparatus or an LRTA(lamp rapid thermal anneal) apparatus can be used. An LRTA apparatus isan apparatus for heating an object by radiation of light (anelectromagnetic wave) emitted from a lamp such as a halogen lamp, ametal halide lamp, a xenon arc lamp, a carbon arc lamp, a high-pressuresodium lamp, or a high-pressure mercury lamp. A GRTA apparatus is anapparatus for heat treatment using a high-temperature gas. As thehigh-temperature gas, an inert gas which does not react with an objectby heat treatment, such as nitrogen or a rare gas like argon, is used.

For example, as the first heat treatment, GRTA may be performed in thefollowing manner: the substrate is moved into an inert gas heated to atemperature as high as 650° C. to 700° C., heated for several minutes,and moved out of the inert gas heated to the high temperature.

When the heat treatment is performed in an atmosphere of an inert gassuch as nitrogen or a rare gas, oxygen, or ultra-dry air, it ispreferable that the atmosphere do not contain water, hydrogen, and thelike. It is also preferable that the purity of nitrogen, oxygen, or therare gas which is introduced into a heat treatment apparatus be set to6N (99.9999%) or higher, preferably 7N (99.99999%) or higher (i.e., theimpurity concentration is 1 ppm or lower, preferably 0.1 ppm or lower).

Next, through a third photolithography process, the oxide semiconductorlayer is partly removed by etching, and the storage gate 104 is formed(see FIG. 6B). Note that a resist mask for forming the storage gate 104may be formed by an inkjet method, in which case manufacturing costs canbe reduced because a photomask is not used.

In the case where a contact hole is formed in the first gate insulatinglayer 102, the contact hole can be formed at the same time as processingof the oxide semiconductor layer.

Note that the etching of the oxide semiconductor layer may be dryetching, wet etching, or both dry etching and wet etching. As an etchantused for wet etching of the oxide semiconductor layer, a mixed solutionof phosphoric acid, acetic acid, and nitric acid can be used, forexample. Alternatively, ITO-07N (produced by Kanto Chemical Co., Inc.)may be used.

After the resist mask is removed, oxygen may be introduced into thestorage gate 104. Oxygen can be introduced by oxygen plasma doping.Specifically, oxygen is turned into plasma with the use ofradio-frequency (RF) power, and oxygen radicals and/or oxygen ions areintroduced into the oxide semiconductor layer over the substrate. Atthis time, it is preferable to apply a bias to the substrate where thestorage gate 104 is formed. By increasing the bias applied to thesubstrate, oxygen can be introduced more deeply. Oxygen may beintroduced by ion implantation.

Oxygen for the doping (an oxygen radical, an oxygen atom, and/or anoxygen ion) may be supplied from a plasma generation apparatus with theuse of a gas containing oxygen or from an ozone generation apparatus.Specifically, for example, oxygen can be generated with an apparatus foretching treatment on a semiconductor device, an apparatus for ashing ona mask, or the like to process the storage gate 104.

By introduction of oxygen into the storage gate 104, the oxidesemiconductor layer contains excessive oxygen. When oxygen is introducedto the oxide semiconductor layer, a hydrogen atom is abstracted from anM-H bond to form an M-OH group.

That is, by the introduction of oxygen, a bond between a metal andhydrogen included in the oxide semiconductor or a bond between theoxygen and hydrogen of a hydroxyl group on the metal is cleaved toproduce water. In particular, oxygen having a unpaired electron easilyreacts with hydrogen remaining in the oxide semiconductor to producewater. Consequently, hydrogen or a hydroxyl group which is an impuritycan be easily eliminated as water by heat treatment performed later.

After the introduction of oxygen to the storage gate 104, second heattreatment is performed (preferably at 200° C. to 600° C., for example,at 250° C. to 550° C.). For example, the second heat treatment isperformed at 450° C. for one hour in a nitrogen atmosphere. It ispreferable that the above atmosphere do not contain water, hydrogen, orthe like.

Through the above steps, dehydration or dehydrogenation of the oxidesemiconductor layer can be performed with the introduction of oxygen andthe heat treatment, whereby remaining impurities including a hydrogenatom (e.g., hydrogen, water, a hydroxyl group, or a hydride (alsoreferred to as a hydrogen compound)), which cannot be removed completelyin the first heat treatment, can be removed from the storage gate 104.In addition, defects generated at the interface between the storage gate104 and the insulating layer in contact with the storage gate 104 can bereduced. In such a manner, the oxide semiconductor used for the storagegate 104 can be purified to be an electrically intrinsic oxidesemiconductor.

Then, the second gate insulating layer 105 is formed to cover thestorage gate 104 and the electrode 103 (see FIG. 6C). The second gateinsulating layer 105 can be formed using a material and a method whichare similar to those of the first gate insulating layer 102.

Next, a semiconductor layer is formed over the second gate insulatinglayer 105. Then, through a fourth photolithography process, thesemiconductor layer is partly removed by etching, thereby forming theisland-shaped semiconductor layer 106 in which a channel of thetransistor 150 is formed. For the semiconductor layer 106, a singlecrystal semiconductor, a polycrystalline semiconductor, amicrocrystalline semiconductor, an amorphous semiconductor, or the likecan be used. Examples of a semiconductor material are silicon,germanium, silicon germanium, silicon carbide, and gallium arsenide. Thetransistor 150 including such a semiconductor material can operate atsufficiently high speed, so that stored data can be read at high speed,for example. In other words, high-speed operation of the semiconductordevice can be realized. Alternatively, an organic semiconductor materialor the like may be used.

Alternatively, an oxide semiconductor can be used for the semiconductorlayer 106. The oxide semiconductor can be formed using a material and amethod which are similar to those of the storage gate 104. The oxidesemiconductor is preferably purified by sufficient removal of impuritiessuch as hydrogen or sufficient supply of oxygen. Specifically, theconcentration of hydrogen in the oxide semiconductor layer is 5×10¹⁹atoms/cm³ or lower, preferably 5×10¹⁸ atoms/cm³ or lower, furtherpreferably 5×10¹⁷ atoms/cm³ or lower, for example. Note that the abovehydrogen concentration of the oxide semiconductor layer was measured bySIMS (secondary ion mass spectrometry).

The oxide semiconductor purified by a sufficient reduction in hydrogenconcentration, in which defect levels in the energy gap due to oxygendeficiency are reduced as a result of sufficient supply of oxygen, has acarrier concentration of less than 1×10¹²/cm³, preferably less than1×10¹¹/cm³, further preferably less than 1.45×10¹⁰/cm³. For example, theoff-state current (per unit channel width (1 μm) here) at roomtemperature (25° C.) is 100 zA/μm (1 zA (zeptoampere) is 1×10⁻²¹ A) orlower, preferably 10 zA/μm or lower. The off-state current at 85° C. is100 zA/μm (1×10⁻¹⁹ A/μm) or lower, preferably 10 zA/μm (1×10⁻²⁰ A/μm) orlower. The transistor 150 with extremely low off-state currentcharacteristics can be obtained with the use of such an oxidesemiconductor that is made to be intrinsic (i-type) or substantiallyintrinsic.

Next, a conductive layer serving as the source electrode and the drainelectrode (as well as a wiring formed by the conductive layer) is formedover the second gate insulating layer 105 and the semiconductor layer106. The conductive layer used for the source and drain electrodes canbe formed using a material and a method which are similar to those ofthe electrode 103. Further, the conductive layer used for the source anddrain electrodes may be formed using a conductive metal oxide. Examplesof the conductive metal oxide are indium oxide (In₂O₃), tin oxide(SnO₂), zinc oxide (ZnO), a mixed oxide of indium oxide and tin oxide(In₂O₃—SnO₂, referred to as ITO), a mixed oxide of indium oxide and zincoxide (In₂O₃—ZnO), and any of these metal oxide materials containingsilicon oxide.

Through a fifth photolithography process, a resist mask is formed overthe conductive layer, selective etching is performed to form the sourceelectrode 107 a and the drain electrode 107 b, and the resist mask isremoved. Note that a resist mask may be formed by an inkjet method, inwhich case manufacturing costs can be reduced because a photomask is notused.

Next, the insulating layer 108 is formed over the semiconductor layer106, the source electrode 107 a, and the drain electrode 107 b (see FIG.6D). The insulating layer 108 can be formed using a material and amethod which are similar to those of the first gate insulating layer102. Sputtering is preferably employed for forming the insulating layer108 in terms of low possibility of entry of hydrogen, water, and thelike. In the case where the semiconductor layer 106 is formed using anoxide semiconductor, if hydrogen is contained in the insulating layer108, hydrogen might enter the oxide semiconductor or extract oxygen inthe oxide semiconductor, which might cause a reduction in resistance ofthe oxide semiconductor (make the oxide semiconductor have n-typeconductivity). Therefore, it is important to form the insulating layer108 by a method through which hydrogen and an impurity containinghydrogen are not contained therein.

For the insulating layer 108, an inorganic insulating material such assilicon oxide, silicon oxynitride, hafnium oxide, aluminum oxide, orgallium oxide can be typically used. Gallium oxide is a material that ishardly charged, and thus can suppress variation in threshold voltage dueto charge build-up of the insulating layer. Note that in the case wherean oxide semiconductor is used for the semiconductor layer 106, a metaloxide layer containing the same kind of component as the oxidesemiconductor may be formed as the insulating layer 108 or stacked overthe insulating layer 108.

In this embodiment, a 200-nm-thick silicon oxide layer is formed as theinsulating layer 108 by sputtering. The substrate temperature in filmformation is higher than or equal to room temperature and lower than orequal to 300° C. and is 100° C. in this embodiment. The silicon oxidelayer can be formed by sputtering in a rare gas (typically argon)atmosphere, an oxygen atmosphere, or a mixed atmosphere of a rare gasand oxygen. As a target, a silicon oxide target or a silicon target canbe used. For example, a silicon oxide layer can be formed by sputteringunder an atmosphere containing oxygen with the use of silicon for thetarget.

In order to remove remaining moisture from the deposition chamber at thetime of formation of the insulating layer 108, an entrapment vacuum pump(e.g., a cryopump) is preferably used. When the insulating layer 108 isformed in the deposition chamber evacuated using a cryopump, theimpurity concentration in the insulating layer 108 can be reduced. Inaddition, as an exhaustion unit for removing moisture remaining in thechamber used for depositing the insulating layer 108, a turbo molecularpump provided with a cold trap may be used.

It is preferable that a high-purity gas from which impurities such ashydrogen, water, a compound containing a hydroxyl group, and a hydrideare removed be used as a sputtering gas for forming the insulating layer108.

Then, third heat treatment may be performed in a reduced pressureatmosphere, an inert gas atmosphere, an oxygen gas atmosphere, or anultra-dry air (preferably at 200° C. to 600° C., for example, 250° C. to550° C.). For example, the third heat treatment may be performed at 450°C. for one hour in a nitrogen atmosphere. In the third heat treatment,part of the semiconductor layer (the channel formation region) is heatedwhile being in contact with the insulating layer 108. It is preferablethat the above atmosphere do not contain water, hydrogen, or the like.

In the case where the semiconductor layer 106 is formed using an oxidesemiconductor, when heat treatment is performed in a state where thesemiconductor layer 106 is in contact with the insulating layer 108containing oxygen, oxygen can be further supplied to the semiconductorlayer 106 from the insulating layer 108 containing oxygen.

Through the above process, the transistor 150 is formed. The protectiveinsulating layer 109 may be further formed over the insulating layer108. For the protective insulating layer 109, an inorganic insulatingmaterial that hardly contains impurities such as moisture, a hydrogenion, or OH⁻ and can prevent entry of such impurities from the outside,such as silicon nitride, aluminum nitride, silicon nitride oxide, oraluminum oxynitride is preferably used. In this embodiment, theprotective insulating layer 109 is formed using silicon nitride (seeFIG. 6D).

A silicon nitride layer used as the protective insulating layer 109 isformed in the following manner: the substrate 100 over which layers upto and including the insulating layer 108 are formed is heated to atemperature ranging from 100° C. to 400° C., a sputtering gas containinghigh-purity nitrogen from which hydrogen and moisture are removed isintroduced, and a silicon target is used. Like the insulating layer 108,the protective insulating layer 109 is preferably deposited whilemoisture remaining in a treatment chamber is removed.

The protective insulating layer 109 is preferably formed in contact withthe first gate insulating layer 102 or the base insulating layer 110placed below the protective insulating layer 109, and prevents entry ofimpurities such as moisture, a hydrogen ion, or OH⁻ from the vicinity ofan edge portion of the substrate.

After the transistor 150 is formed, heat treatment may be furtherperformed at 100° C. to 200° C. for 1 to 30 hours in the air. This heattreatment may be performed at a fixed heating temperature.Alternatively, it is possible that the following change in temperatureis set as one cycle and repeated plural times: the temperature isincreased from room temperature to a heating temperature and thendecreased to room temperature.

Alternatively, without performing the first heat treatment, the secondheat treatment may be performed under the conditions of the first heattreatment.

Note that in the transistor 150, edges of the control gate 101, theelectrode 103, the source electrode 107 a, and the drain electrode 107 bare preferably tapered. Here, the taper angle is 30° to 60°, forexample. Note that the taper angle refers to an inclination angle formedby a side surface and a bottom surface of a layer when the layer isobserved from the direction perpendicular to the cross section of thelayer (i.e., the plane perpendicular to the surface of the substrate).When the edges of the control gate 101, the electrode 103, the sourceelectrode 107 a, and the drain electrode 107 b are tapered, coveragethereof with a layer formed in a later step can be improved anddisconnection can be prevented.

FIG. 7A illustrates a transistor 160 as a structural example of the casewhere a back gate 111 is formed in the transistor 150. The back gate 111is positioned so that the channel formation region of the semiconductorlayer 106 is placed between the back gate 111 and the control gate 101or the storage gate 104. The back gate 111 can be formed using amaterial and a method similar to those of the control gate, the sourceelectrode, the drain electrode, and the like.

In FIG. 7A, the back gate 111 is formed over the channel formationregion of the semiconductor layer 106 with the insulating layer 108 andthe protective insulating layer 109 placed therebetween. FIG. 7Aillustrates the example in which the back gate 111 is formed over theprotective insulating layer 109; alternatively, the back gate 111 may beformed between the insulating layer 108 and the protective insulatinglayer 109.

The back gate 111 may be connected to one of the source electrode 107 aand the drain electrode 107 b, or may be connected nowhere andelectrically floating (in a floating state). The placement of the backgate 111 can reduce variations in characteristics which are caused whena plurality of transistors are formed in the semiconductor device, andrealize high stability in operation of the semiconductor device.

The oxide semiconductor used for the semiconductor layer in thisembodiment is an intrinsic (i-type) oxide semiconductor or asubstantially intrinsic oxide semiconductor. The intrinsic (i-type)oxide semiconductor or substantially intrinsic oxide semiconductor isobtained in such a manner that hydrogen having the property as a donoris removed from an oxide semiconductor as much as possible, and theoxide semiconductor is purified so as to contain impurities as little aspossible. In other words, a feature of such an oxide semiconductor liesin that a purified i-type semiconductor or a substantially intrinsicsemiconductor is obtained not by adding an impurity but by removing animpurity such as hydrogen or water as much as possible. That is, theoxide semiconductor layer used in the above transistor is an oxidesemiconductor layer that is purified and made to be electricallyintrinsic.

The number of carries in the purified oxide semiconductor is very small(close to zero), and the carrier concentration can be lower than1×10¹⁴/cm³, preferably lower than 1×10¹²/cm³, further preferably lowerthan 1×10¹¹/cm³.

Since the number of carriers in the oxide semiconductor is extremelysmall, the off-state current of a transistor can be reduced. The smalleramount of off-state current is more preferable.

Specifically, in a transistor in which the above oxide semiconductor isused for a channel formation region, the off-state current per 1 μm ofchannel width at room temperature can be 10 aA (1×10⁻¹⁷ A/μm) or lower,further reduced to 1 aA (1×10⁻¹⁸ A/μm) or lower, still further reducedto 1 zA (1×10⁻²¹ A/μm) or lower, and still further reduced to 1 yA(1×10⁻²⁴ A/μm).

In addition, the on-state current of the transistor including the aboveoxide semiconductor in the channel formation region has almost notemperature dependence, and variation in off-state current is extremelysmall.

Furthermore, the transistor including the above oxide semiconductor inthe channel formation region can be a highly reliable transistor inwhich the amount of change in the threshold voltage of the transistor byexternal stimuli (e.g., those in a bias-temperature stress (BT) test)can be reduced.

The transistor including the above oxide semiconductor can haverelatively high field-effect mobility and thus can operate at highspeed.

As described above, a semiconductor device that includes an oxidesemiconductor and has stable electric characteristics can be provided.Therefore, a semiconductor device with high reliability can be provided.

Note that the method for manufacturing the bottom-gate transistor isdescribed as an example in this embodiment; however, the transistor inthis embodiment is not limited to having a bottom-gate structure. Atransistor 170 illustrated in FIG. 7B is an example of a top-gatetransistor. Although the positions where each of the control gate 101and the semiconductor layer 106 is stacked are different from those inthe transistor 150, the transistor 170 can be formed using a materialand a method similar to those of the transistor 150.

In the case where the back gate 111 is provided in the transistor 170,the back gate 111 can be provided, for example, between the substrate100 and the base insulating layer 110 so as to overlap with thesemiconductor layer 106.

Since the semiconductor layer 106 can be provided as the bottom layer inthe top-gate transistor, when a single crystal substrate such as asilicon wafer is used as the substrate 100, part of the single crystalsubstrate can be easily used as the semiconductor layer 106.

This embodiment can be implemented in combination with other embodimentsas appropriate.

Embodiment 3

In this embodiment, examples of an electronic device to which thesemiconductor device described in the above embodiment is applied willbe described with reference to FIGS. 8A to 8F. Specifically, thisembodiment explain applications of the semiconductor device described inthe above embodiment to electronic devices such as a computer, a mobilephone handset (also referred to as a mobile phone or a mobile phonedevice), a personal digital assistant (including a portable game machineand an audio reproducing device), a camera such as a digital camera anda digital video camera, electronic paper, and a television device (alsoreferred to as a television or a television receiver).

FIG. 8A illustrates a laptop personal computer including a housing 701,a housing 702, a display portion 703, a keyboard 704, and the like. Thesemiconductor device described in the above embodiment is provided ineach of the housings 701 and 702. Thus, it is possible to realize alaptop personal computer in which data is written and read at highspeed, data can be retained for a long time, and power consumption issufficiently low.

FIG. 8B illustrates a personal digital assistant (PDA). A main body 711is provided with a display portion 713, an external interface 715,operation buttons 714, and the like. Further, a stylus 712 or the likefor operating the personal digital assistant is provided. Thesemiconductor device described in the above embodiment is provided inthe main body 711. Thus, it is possible to realize a personal digitalassistant in which data is written and read at high speed, data can beretained for a long time, and power consumption is sufficiently low.

FIG. 8C illustrates an e-book reader 720 including electronic paper, andthe e-book reader 720 includes two housings of a housing 721 and ahousing 723. The housing 721 and the housing 723 are provided with adisplay portion 725 and a display portion 727, respectively. Thehousings 721 and 723 are connected by a hinge portion 737 and can beopened or closed with the hinge portion 737. The housing 721 is providedwith a power switch 731, an operation key 733, a speaker 735, and thelike. At least one of the housings 721 and 723 is provided with thesemiconductor device described in the above embodiment. Thus, it ispossible to realize an e-book reader in which data is written and readat high speed, data can be retained for a long time, and powerconsumption is sufficiently low.

FIG. 8D illustrates a mobile phone including two housings of a housing740 and a housing 741. The housing 740 and the housing 741 developed asillustrated in FIG. 8D can shift by sliding so that one is lapped overthe other; therefore, the size of the mobile phone can be reduced, whichmakes the mobile phone suitable for being carried. The housing 741 isprovided with a display panel 742, a speaker 743, a microphone 744, apointing device 746, a camera lens 747, an external connection terminal748, and the like. The housing 740 is provided with a solar cell 749 forcharging the mobile phone, an external memory slot 750, and the like. Anantenna is incorporated in the housing 741.

The display panel 742 is provided with a touch panel. A plurality ofoperation keys 745 displayed as images are indicated by dashed lines inFIG. 8D. Note that the mobile phone includes a booster circuit forraising a voltage output from the solar cell 749 to a voltage needed foreach circuit.

At least one of the housings 740 and 741 is provided with thesemiconductor device described in the above embodiment. Thus, it ispossible to realize a mobile phone in which data is written and read athigh speed, data can be retained for a long time, and power consumptionis sufficiently low.

FIG. 8E illustrates a digital camera including a main body 761, adisplay portion 767, an eyepiece 763, an operation switch 764, a displayportion 765, a battery 766, and the like. The semiconductor devicedescribed in the above embodiment is provided in the main body 761.Thus, it is possible to realize a digital camera in which data iswritten and read at high speed, data can be retained for a long time,and power consumption is sufficiently low.

FIG. 8F illustrates a television device 770 including a housing 771, adisplay portion 773, a stand 775, and the like. The television device770 can be operated with an operation switch of the housing 771 or aremote controller 780. The housing 771 and the remote controller 780 areeach provided with the semiconductor device described in the aboveembodiment. Thus, it is possible to realize a television device in whichdata is written and read at high speed, data can be retained for a longtime, and power consumption is sufficiently low.

As described above, the electronic devices described in this embodimenteach include the semiconductor device described in the above embodiment;thus, electronic devices with low power consumption can be realized.

EXPLANATION OF REFERENCE

-   100: substrate, 101: control gate, 102: first gate insulating layer,    103: electrode, 104: storage gate, 105: second gate insulating    layer, 106: semiconductor layer, 107 a: source electrode, 107 b:    drain electrode, 108: insulating layer, 109: protective insulating    layer, 110: base insulating layer, 111: back gate, 150: transistor,    160: transistor, 170: transistor, 180: portion, 181: edge, 200:    memory cell, 201: first wiring, 202: second wiring, 203: third    wiring, 204: fourth wiring, 210: transistor, 211: control gate, 212:    storage gate, 300: capacitor, 301: electrode, 302: oxide    semiconductor, 303: insulator, 304: electrode, 311: curve, 312:    curve, 701: housing, 702: housing, 703: display portion, 704:    keyboard, 711: main body, 712: stylus, 713: display portion, 714:    operation button, 715: external interface, 720: e-book reader, 721:    housing, 723: housing, 725: display portion, 727: display portion,    731: power switch, 733: operation key 735: speaker, 737: hinge    portion, 740: housing, 741: housing, 742: display panel, 743:    speaker, 744: microphone, 745: operation key, 746: pointing device,    747: camera lens, 748: external connection terminal, 749: solar    cell, 750: external memory slot, 761: main body, 763: eyepiece, 764:    operation switch, 765: display portion, 766: battery, 767: display    portion, 770: television device, 771: housing, 773: display portion,    775: stand, 780: remote controller, 1200: memory cell, 1210:    transistor, 1211: control gate, 1212: storage gate, 1221: first    driver circuit, 1222: second driver circuit, 1223: third driver    circuit, 1224: fourth driver circuit

This application is based on Japanese Patent Application serial No.2010-145339 filed with Japan Patent Office on Jun. 25, 2010, the entirecontents of which are hereby incorporated by reference.

The invention claimed is:
 1. A semiconductor device comprising: asemiconductor layer comprising a channel region; an insulating layerover the semiconductor layer; an oxide semiconductor layer over and indirect contact with the insulating layer, the oxide semiconductor layeroverlapping with the channel region; and an electrode over theinsulating layer, the electrode directly contacting with the oxidesemiconductor layer, wherein the oxide semiconductor layer is not indirect contact with the semiconductor layer.
 2. The semiconductor deviceaccording to claim 1, wherein the semiconductor layer comprises a singlecrystal semiconductor, a polycrystalline semiconductor, amicrocrystalline semiconductor, or an amorphous semiconductor.
 3. Thesemiconductor device according to claim 1, further comprising a sourceand a drain which sandwich the channel region.
 4. The semiconductordevice according to claim 1, further comprising a second insulatinglayer over the electrode, the oxide semiconductor layer, and theinsulating layer.
 5. The semiconductor device according to claim 1,wherein the oxide semiconductor layer comprises gallium, indium, zinc,and oxygen.
 6. A semiconductor device comprising: a single crystallinesemiconductor comprising a channel region, a source, and a drain, thechannel region being sandwiched between the source and the drain; aninsulating layer over the channel region; an oxide semiconductor layerover and in direct contact with the insulating layer; and an electrodeover the insulating layer, the electrode directly contacting with theoxide semiconductor layer, wherein the oxide semiconductor layer is notin direct contact with the single crystalline semiconductor.
 7. Thesemiconductor device according to claim 6, further comprising a secondinsulating layer over the electrode, the oxide semiconductor layer, andthe insulating layer.
 8. The semiconductor device according to claim 6,wherein the oxide semiconductor layer comprises gallium, indium, zinc,and oxygen.
 9. The semiconductor device according to claim 6, whereinthe electrode is configured to be applied with a first potential and asecond potential which is lower than the first potential.
 10. Asemiconductor device comprising: a semiconductor layer comprising achannel region; an insulating layer over the semiconductor layer; afirst electrode over and in direct contact with the insulating layer; anoxide semiconductor layer over the insulating layer, the oxidesemiconductor layer overlapping and directly contacting with at least apart of the first electrode; and a second electrode over the oxidesemiconductor layer, wherein the oxide semiconductor layer is not indirect contact with the semiconductor layer.
 11. The semiconductordevice according to claim 10, wherein the semiconductor layer comprisesa single crystal semiconductor, a polycrystalline semiconductor, amicrocrystalline semiconductor, or an amorphous semiconductor.
 12. Thesemiconductor device according to claim 10, further comprising a sourceand a drain which sandwich the channel region.
 13. The semiconductordevice according to claim 10, further comprising a second insulatinglayer over the second electrode.
 14. The semiconductor device accordingto claim 10, wherein the oxide semiconductor layer comprises gallium,indium, zinc, and oxygen.
 15. A semiconductor device comprising: asingle crystalline semiconductor comprising a channel region, a source,and a drain, the channel region being sandwiched between the source andthe drain; an insulating layer over the channel region; a firstelectrode over and in direct contact with the insulating layer; and anoxide semiconductor layer over the insulating layer, the oxidesemiconductor layer overlapping and directly contacting with at least apart of the first electrode; and a second electrode over the oxidesemiconductor layer, wherein the oxide semiconductor is not in directcontact with the single crystalline semiconductor.
 16. The semiconductordevice according to claim 15, further comprising a second insulatinglayer over the second electrode.
 17. The semiconductor device accordingto claim 15, wherein the oxide semiconductor layer comprises gallium,indium, zinc, and oxygen.
 18. The semiconductor device according toclaim 15, wherein the first electrode is configured to be applied with afirst potential and a second potential which is lower than the firstpotential.